Answer :
Main Answer:
The given statement "The TEC is glued to a heat sink which cools down one side of the TEC. You will add two further heat sink blocks with heat sink compound between them." is true because additional heat sink blocks with heat sink compound enhance heat dissipation efficiency.
Thus, the correct option is a.
Explanation:
The Thermoelectric Cooler (TEC) transfers heat from one side to another when an electric current flows through it. Placing a heat sink on one side aids in dissipating heat efficiently. By adding two more heat sink blocks with heat sink compound between them, the cooling capacity increases further.
The compound enhances thermal conductivity, ensuring optimal heat transfer between the TEC and the additional heat sinks. This setup effectively maintains the desired temperature gradient across the TEC, enhancing its cooling performance.
Thus, the statement is true as it correctly describes a method to improve the cooling efficiency of the TEC system.
Therefore, the correct option is (a) True
