Answer :
The correct answer(s) are:Thermal conduction, Convection.
Heat sinks are designed to dissipate heat from a device, such as the hot side of a thermoelectric cooler (TEC). The physical principles behind the action of heat sinks in reducing the temperature of the hot side of the TEC are as follows:
1. Thermal Conduction : This is the primary mechanism by which heat sinks work. The heat sink is typically made of a material with high thermal conductivity, such as aluminum or copper, which allows it to efficiently absorb heat from the hot side of the TEC. The heat is then conducted through the heat sink material to a larger surface area.
2. Convection : As the heat sink absorbs heat, it transfers this heat to the surrounding air. This causes the air in contact with the heat sink to warm up, become less dense, and rise. Cooler air then takes its place, and the process repeats, creating a convective current that carries heat away from the heat sink. This natural convection can be enhanced by adding fins to the heat sink, which increases the surface area in contact with the air, thereby improving heat transfer.
The other options listed do not directly contribute to the primary function of a heat sink in this context:
- Radiation : While all objects radiate heat in the form of infrared radiation, this effect is relatively small compared to conduction and convection in the typical operating range of heat sinks.
- Heat Capacity : This refers to the amount of heat a material can store per unit of temperature change. While a heat sink does have a certain heat capacity, it is not the primary means by which it cools the TEC. Instead, the goal is to continuously transfer heat away from the TEC, not to store it.
- Latent Heat : This is the heat absorbed or released by a substance during a change in phase (e.g., solid to liquid or liquid to gas). While phase transformation materials (PCMs) can be used in some thermal management applications to absorb large amounts of heat, they are not typically used in conventional heat sinks for electronic cooling.
- Phase Transformation : Similar to latent heat, phase transformation is not a primary mechanism in standard heat sink operation. Heat sinks used in conjunction with TECs typically rely on conduction and convection rather than undergoing phase changes.
Therefore, the key principles at play in the operation of heat sinks for cooling the hot side of a TEC are thermal conduction and convection.
The physical principles behind the action of the heat sinks that help to reduce the temperature of the hot side of the TEC are thermal conduction and convection. Thus, the correct options are C and D. Research: Research is a process of investigating the problem systematically to get new knowledge or validate existing knowledge.
Research can be done on different types of problems, and it is generally a methodical and systematic approach. Compound: Compound means a substance that contains two or more different chemical elements that are bonded together. For example, water is a compound of hydrogen and oxygen atoms. What is a heat sink? A heat sink is a device that is used for heat dissipation. It is commonly used in electronic devices to absorb heat from electronic components and then dissipate it into the surrounding air. A heat sink is made of thermally conductive materials such as aluminum or copper, and it is designed in such a way that it provides a large surface area for the heat to dissipate. The physical principles behind the action of the heat sinks that help to reduce the temperature of the hot side of the TEC are thermal conduction and convection. When two heat sinks blocks with heat sink compound between them are added, they work in the following ways: Thermal conduction: When two heat sink blocks are added with heat sink compound between them, it increases the thermal conductivity of the system.
This means that the heat from the hot side of the TEC will quickly transfer to the heat sink blocks. Convection: The heat sink blocks added between the TEC and the main heat sink also help to increase the surface area available for convection. Thus, the hot air surrounding the TEC will be forced away from the system, and cool air will be drawn in to replace it. This helps to further reduce the temperature of the hot side of the TEC.
Read more about systematically here;https://brainly.com/question/4467560
#SPJ11
